Tạp chí
 
Năm 2019
 
Số 6 [12 - 2019], Năm thứ XXXIII

Quy trình công nghệ sản xuất thiếc hàn không chì dạng kem

https://tapchi.hoimovietnam.vn/vi/archives?article=19067

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  • Nhận bài: 26-04-2019
  • Sửa xong: 24-11-2019
  • Chấp nhận: 10-12-2019
  • Ngày đăng: 31-12-2019
Trang: 40 - 44
Lượt xem: 3
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Lượt tải: 0
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Tóm tắt:

The article introduces the research results of SAC305 solder paste successfully manufactured with Sn-3.0Ag-0.5Cu. In this study, SAC305 alloy powder was synthesized by chemical reduction method with NaBH4 reducing agent at room temperature. The analytical results show that during the alloying process, the alloy particles are homogenously mixed together. In the tests of solder wetting cream, the connection between solder paste and substrate is quite good. SAC305 solder paste solder products can be used as production materials for component factories, electronics and electrical equipment factories,...

Trích dẫn
Trẩn Thụy Thúy Vi, Trần Công Hiệp, Trần Huy Thông, Ngô Hoàng Đạo và Trần Thúy Uyên, 2019. Quy trình công nghệ sản xuất thiếc hàn không chì dạng kem, Tạp chí Công nghiệp Mỏ, số XXXIII, kỳ 6, tr. 40-44.
Tài liệu tham khảo

1. Hongjin Jiang, Kyoung-sik Moon, C. P. Wong, «Tin/Silver/Copper Alloy Nanopartlde Pastes for Low Temperature Lead-free Interconnect Applications)) Electronic Components and Technology Conference, 2008, p1400-1404.

2. Ali Roshanghias, AndrtyYakymovych, Johannes Johannes Bernardi, Herbert Ipser, «Synthesis and thermal behavior of tin-based alloy (Sn-Ag-Cu) nanoparticles» Nanoscale, 2015, 7, p5843-5851.

3. RanjitPandher, Tom Lawlor «Effect of Silver in common lead-free alloys», Cool^son Electronics Assembly Materials.

4. Li-Yin Hsiao, Jeng-Gong, «Syntliesis and Characterization of Lead-Free Solders with Sn-3.5Ag-xCu (x = 0.2, 0.5, 1.0) Alloy Nanoparticles by the Chemical Reduction Method» Journal of The Electrochemical Society, 152_9_J105-J109 _2005.

5. https://en.w/ikipedia.org/wiki/Scherrer_equation

6. Hsin Jen Pan, Chao Yang Lin, Udit Surya Mohanty, Jung Hua Chou, «Synthesis of Sn-3.5Ag Alloy Manosolder by Chemical Reduction Method» Materials Sciences and Applications, 2011, 2,p1480-1484.

7. Weipeng Zhang, Bingge Zhao, Changdong Zou, Qijie Zhai, Yulai Gao, Steve F. A. Acquah, «lnvestigating the Formation Process of Sn-Based Lead-Free Nanoparticles with a Chemical Reduction Method» Journal of Nanomaterials, Volume 2013.

8. Lin C.Y., Mohanty U.S., Chou J.H. «High temperature synthesis of Sn-3.5Ag-0.5Zn alloy nanoparticles by chemical reduction methode». Journal of Alloys and Compounds, 2010, 501, 204-210.

9. Changdong Zou, Yulai Gao, Bin Yang, Qijie Zhai, «Nanoparticles of Sn3.0Ag0.5Cu alloy synthesized at room temperature with large melting temperature depression». Journal of Materials Science, p1-6, 2011.

10. Bingge Zhao, Weipeng Zhang, Changdong Zou, Qijie Zhai, Steve F.A.Acquah.Yulai Gao «Low melting point nanocrystalline Sn-Ag solder synthesized by a refined chemical reduction method» China Science Bull, 59, p4147-4151, 2014.

11. Siu-kwong Pang, Kam-chuen Yung «A green approach to synthesis of Nanoparticles of Sn-3.0Ag-0.5Cu Lead-free» Materials Transaction, vol 53, pi 770-1774, 2012.

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